Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market faster.      

1. IC-Link by imec and TSMC are expanding their collaboration through TSMC Open Innovation…

The global demand for power electronics and chips for applications in automotive, communication, and industrial sectors continues to grow unabated. However, many of the manufacturing facilities originate from a different era: 200-mm wafer factories established in the 1990s and 2000s are still operat…

– Imec presents the world’s first Ge/Si avalanche photodiode (APD) to combine 100 GHz bandwidth, low-voltage (5 V) operation and a responsivity of 1.8 A/W across both the O- and C-bands.
– Combined with imec's previously demonstrated beyond-110 GHz Ge/Si electro-absorption modulator (EAM), the device…

– At the 2026 Applied Superconductivity Conference, imec demonstrates two world-firsts: (1) a three-metal-level (3ML) niobium-titanium-nitride (NbTiN)-based Josephson junction circuit, achieving circuit design densities of 3.8 million junctions per cm2; and (2) 3ML NbTiN routing with superconducting…

The Fraunhofer Institute for Photonic Microsystems IPMS has expanded its 300 mm technology platform with a highly flexible physical vapor deposition (PVD) system, reinforcing its capabilities in developing CMOS-compatible materials and processes for next-generation quantum computing. Installed in co…

Systematically investigate, evaluate, and targetedly develop thousands of material variants – this is made possible by the new Energy Materials Acceleration Platform (E-MAP) at the Karlsruhe Institute of Technology (KIT). It combines automated experiments with precise material characterization, layi…

The room hums to the sound of powerful ventilators. In the pale light, Peter Rimpf pulls a full-body coverall with hood over his clothes, steps into clean room shoes and snaps a nitrile glove onto each hand. “A single flake of skin can destroy a dozen chips,” says Rimpf, who heads operations at the…

– Imec optimizes CAR-based technology for the High NA EUV single patterning of several layers of the A14/A10 logic technology nodes.
– A variety of tight-pitch logic metal line and via structures have been demonstrated, including meander and forked e-test structures down to 22nm pitch, 24nm SRAM layo…

On 21st July 2026, IHP - Leibniz Institute for High Performance Microelectronics and Chile's Advanced Center for Electrical and Electronic Engineering (AC3E) announced a three-year collaboration to promote open-source semiconductor technologies, design tools and manufacturing. 

The cooperation bridges…

In semiconductor manufacturing, seamless traceability, unique operator identification, and standardized processes are essential prerequisites for consistently high product quality. Especially at manual workstations, reliable operator identification ensures that process steps are clearly documented a…