Highly sensitive light sensors are needed, among other applications, in quantum communication, medical technology, and autonomous driving. Researchers at the Institute for Semiconductor Technology (IHT) at the University of Stuttgart have developed a photodetector based on germanium, which is more c…
New sensor technology measures critical chemicals directly in the running process and helps semiconductor manufacturers detect process deviations earlier, reduce (lab) effort and run wet processes more stably.
In semiconductor manufacturing, reliable, controlled wet processes determine yield, quality…
1. Imec presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography.
2. This demonstration marks a milestone toward the industrial scaling of more reliable qubits, the basic computational units of quantum computers. Quantum computers will perform exponentially bette…
– Imec presents the first 3D implementation of a charge coupled device (CCD) with indium-gallium-zinc-oxide (IGZO) channel, with potential for AI memory applications.
– Due to the cost-effective fabrication, high bit density, and block-addressable nature, the 3D CCD device shows promise to be used as…
The Fraunhofer Institute for Production Technology IPT in Aachen, together with project partners, has developed a process chain for manufacturing 3D thin glass with functionalized surfaces. The process chain combines laser structuring with subsequent forming and reduces energy consumption as well as…
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosy…
With the Micro System Analyzers (MSA-600, MSA-650 IRIS, MSA-100-3D), Polytec has been addressing contactless characterization of MEMS dynamics and topography for years – from individual dies to wafer-level testing on probe stations. The current expansion combines this optical measurement technology…
Silicon carbide (SiC) is a promising material platform for photonic integrated circuits (PICs) and miniaturized solid-state quantum systems. In the ALP-4-SiC project – Atomic Layer Processing for SiC for Applications in Photonics and Quantum Communication – researchers from the Max Planck Institute…
Fraunhofer ISIT strengthens its expertise in microfabrication: Prof. Dr. Erica Lilleodden takes over the leadership of the Microfabrication Processes business unit. The materials scientist brings international experience from research and institute management. At ISIT, she develops manufacturing pro…
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European platform for advanced embedded non-volatile memory technologies. Launched in December 2023 and coordin…
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