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Metal bellows coupling KGH VA stainless steel (Copyright: JAKOB Drive Technology GmbH)
  • Standard-, operating-parts, valves, connectors, ...

Corrosion-resistant, easy to clean, and particularly hygienic

Wave couplings made of stainless steel meet hygiene requirements for the pharmaceutical industry

Stainless steel shaft couplings are used in the food, pharmaceutical, and medical technology industries because they are corrosion-resistant, easy to clean, and hygienic. The smooth, rust-free surface prevents dirt and germ accumulation and meets high hygiene standards.

JAKOB Drive Technology GmbH no…

Figure 1 - (A) X-cut HAADF STEM for a WS2 device with a CPP of 50nm, a contact length of 19nm and width of 256nm, after gate connection line etch. And (B) corresponding energy dispersive X-ray spectroscopy (EDS) EDS analysis. Figure 2 – MoS2 nFETs and WSe2 pFETs with 50nm contact pitch and relaxed channel width (650nm), integrated on the same 300mm wafer, show proper threshold voltage matching.
  • Electronics (wafers, semiconductors, microchips,...)

Novel 300mm integration approach for 2D-material based devices enables scaled n and pFETs with 50nm contacted poly pitch.

ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

– ASML, TSMC, and imec introduce an innovative 300-mm integration process for transistors based on 2D materials, enabling the first scalable n- and p-FETs with a contact pitch (CPP) of 50 nm, structured using EUV lithography.
– Good results were achieved with scaled nFETs (with MoS2 channel) and pFET…

High-density MIMCAP in a 300mm silicon interposer High-density MIMCAP in a 300mm silicon interposer
  • Electronics (wafers, semiconductors, microchips,...)

Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding

– Imec is evolving its 300mm RF silicon interposer into a unique, system-level platform for the heterogeneous integration of III‑V chiplets on Si‑CMOS – targeting mmWave/sub‑THz wireless and high‑speed data center applications.
– A new MIMCAP architecture delivers a 10-to-100-fold increase in capacit…

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