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- Company
Sanner Group appoints Dirk Scholz as the new CFO
Sanner, a globally leading manufacturer of healthcare packaging and CDMO for medical technology products, has appointed Dirk Scholz as the new Chief Financial Officer (CFO). He joined the company on May 2, 2026.
Dirk Scholz brings extensive expertise and a track record of more than 30 years in financ…
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- 3D printing
Less CO₂ emissions, no toxic chemicals: Fraunhofer IPT develops a new process chain for functionalized thin glass
The Fraunhofer Institute for Production Technology IPT in Aachen, together with project partners, has developed a process chain for manufacturing 3D thin glass with functionalized surfaces. The process chain combines laser structuring with subsequent forming and reduces energy consumption as well as…
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- Trade fair
ASYS Group Redefines AOI – Autonomous Inspection as a Key Enabler for Process-Stable Power Electronics
With the presentation of AISPECTURE AOI – the “World’s first true unsupervised inspection”, the ASYS Group sets a new technological benchmark in power electronics manufacturing at PCIM Europe 2026. The solution represents a fundamental paradigm shift: moving away from supervised, parameter-driven in…
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- EDP, Hardware, Software
Modular Software Platform for Pharma 4.0: Virtual Planning and Certifiable Quality
Fraunhofer IESE Develops VIMOPROP for Digital Pharmaceutical Production
The Fraunhofer Institute for Experimental Software Engineering IESE has developed VIMOPROP, a modular software platform that supports pharmaceutical manufacturers in the virtual design, simulation, and commissioning of production processes. The platform makes a concrete contribution to the implement…
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- Electronics (wafers, semiconductors, microchips,...)
Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects
IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosy…
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- People
Leadership change in materials technology at FBH
Lasers for space applications, power transistors for energy-efficient electronics, or components for quantum systems – all these developments originate in materials technology. This is where ultrathin semiconductor layer stacks with precisely defined properties are created. Using metal-organic vapor…
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- New building
Ceremonial groundbreaking marks the start of the first construction phase
Vetter begins construction of the new production site in Saarlouis
– Pharmaceutical service provider celebrates groundbreaking with project partners and representatives from land and region
– Production building with 50,000 m² area marks the start of construction work
– New location is part of global growth and investment initiatives
Vetter, one of the world's leading…
