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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

Figure 1 – Top-down SEM images of meanders (left) and forks (right) with a 20 nm pitch after pattern transfer into a TiN hard mask.

Figure 2 – TEM image of metallized wires with a 20 nm pitch after a chemical-mechanical polishing (CMP) process.

24.02.2025
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Electronics (wafers, semiconductors, microchips,...)

First electrical tests at 20nm pitch present a next milestone in validating the High NA extreme ultraviolet (EUV) patterning ecosystem

Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning

This week at SPIE Advanced Lithography + Patterning, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents the first electrical test (e-test) results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography…

Cleanroom Production Line (Claudia Feith, Hahn-Schickard)

(v. l. n. r.: Dr. Simon Thiele, CTO, Printoptix GmbH; Stefan Wagner, Group Leader Precision Toolmaking + Plastics Technology, Hahn-Schickard; Dr. Karl-Peter Fritz, Institute Director Hahn-Schickard; Dr. Wolfgang Eberhardt, Head of Technology Department, Hahn-Schickard; Dr. Patrick Rapp, State Secretary, Ministry of Economics, Labour and Tourism Baden-Württemberg; Jennifer Mazat, Department 33 Automotive and Manufacturing Industry, Logistics, Ministry of Economics, Labour and Tourism Baden-Württemberg; Prof. Dr. André Zimmermann, Institute Director Hahn-Schickard and IFM of the University of Stuttgart; Dr. Tobias Grözinger, PCB-based AIT, Packaging (CR/APT3), Robert Bosch GmbH; Simon Petillon, Research Associate Laser Technology, Hahn-Schickard)

20.02.2025
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Science

In addition to research topics, the challenges of applied research and collaboration with industry were the main focus of the visit.

Economic State Secretary Dr. Patrick Rapp visits the Hahn-Schickard Institute for Microfabrication Technology in Stuttgart

The institute directors Prof. Dr. André Zimmermann and Dr. Karl-Peter Fritz welcome State Secretary Dr. Patrick Rapp from the Ministry of Economic Affairs, Labour and Tourism Baden-Württemberg. Dr. Rapp met with scientific staff and industry partners of the institute for an exchange on current chall…

A technician in the cleanroom at Infineon Technologies in Villach, Austria, holds a 200 mm silicon carbide wafer.

A technician in the cleanroom at Infineon Technologies in Villach, Austria, is holding a 200 mm silicon carbide wafer.

18.02.2025
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Electronics (wafers, semiconductors, microchips,...)

Infineon reaches next milestone on 200 mm silicon carbide (SiC) roadmap: Product-roll out to customers starts

– Infineon releases first silicon carbide products to customers based on advanced 200 mm SiC wafer manufacturing technology
– The products, manufactured in Villach, Austria, provide first-class SiC power technology for high-voltage applications
– 200 mm SiC production will strengthen Infineon's techno…

Work in the 200-mm cleanroom at Fraunhofer IPMS. © Fraunhofer IPMS

Ceremonial presentation of the symbolic check for 38 million euros from Prime Minister Michael Kretschmer to the Saxon microelectronics institutes of the Fraunhofer Society (from left to right: Prof. Dr. Harald Kuhn [Fraunhofer ENAS], Prof. Dr. Martin Schneider-Ramelow [Fraunhofer IZM], Prof. Dr. Harald Schenk [Fraunhofer IPMS], Prime Minister Michael Kretschmer, Dr. Stephan Guttowski [Research Factory Microelectronics Germany], Prof. Dr. Peter Schneider [Fraunhofer IIS, Institute Division for Development of Adaptive Systems], Dr. Oliver Höing [Federal Ministry of Education and Research BMBF]) © Fraunhofer IPMS

Design of chiplet-based systems using a modular approach. © Fraunhofer IPMS

07.02.2025
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Electronics (wafers, semiconductors, microchips,...)

Saxony promotes microelectronics research within the framework of the EU Chips Act with 38 million euros

Strengthening Saxon microelectronics research for chiplet innovations within the framework of the APECS pilot line

The Saxon microelectronics institutes of the Fraunhofer Society are expanding their technological capacities in the field of chiplet innovation and making a significant contribution to the APECS pilot line within the framework of the European Chips Act. The state of Saxony is investing 38 million eu…

From now on, the systems from Rehm Thermal Systems can be produced in the factory in Dongguan, China, under cleanroom conditions. (Copyright: Rehm Thermal Systems)

27.01.2025
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Electronics (wafers, semiconductors, microchips,...)

Rehm Thermal Systems produces in new cleanroom

A new standard for quality

For the production of many products, such as semiconductors, cleanrooms are an essential prerequisite for high quality and product safety, as even the smallest contaminants can damage the final product. To enable the systems to be used in cleanrooms in the future, Rehm Thermal Systems has built a cl…

Surface Light Modulator Evaluation Kit. © Fraunhofer IPMS / Spatial Light Modulator Customer Evaluation Kit. © Fraunhofer IPMS

Micromirror array spatial light modulator in ceramic housing; 512 x 320 individually addressable 2-axis tilting mirrors with 48 μm pixel size. © Fraunhofer IPMS

Micromirror array surface light modulator with one million individual mirrors. © Fraunhofer IPMS / Sven Döring / Spatial light modulator micromirror array with one million individual mirrors. © Fraunhofer IPMS / Sven Döring

27.01.2025
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Trade fair

The versatile optical systems from Fraunhofer IPMS at Photonics West

Modulation, manipulation, precision: spatial light modulators for industry and research

Due to the increasing miniaturization and complexity in the semiconductor industry, but also in many other technical sectors and industries, high-precision and effective ways of projecting light, processing materials or sending optical signals are required - with precision in the nanometer range and…

The housing of VCSEL laser diodes with integrated temperature control is extremely compact. © Fraunhofer IOF

Schematic representation of the eight-channel VCSEL source for polarization-encrypted photons. © Fraunhofer IOF

Representation of the VCSEL source on the circuit board with KOVAR frame. The housing contains the optics, which are attached to the top of the VCSEL chip. The glass tip on the housing is the waveguide combiner through which the polarization signal exits. © Fraunhofer IOF / The VCSEL source on the ceramic printed circuit board (PCB) is shown with the KOVAR frame housing. The tiny glass tip on top of the housing is the waveguide combiner, where the polarization signal comes to exit. © Fraunhofer IOF

The source is mounted on a ceramic printed circuit board (PCB) with a molybdenum heatsink. The PCB carries the VCSEL and driver chip (center). The wings are plugs for thermal management components. © TU Ilmenau

23.01.2025
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Trade fair

Photonics West 2025: Fraunhofer IOF presents VCSEL-based photon source for quantum-encrypted communication

Ultra-compact light source for quantum encryption

The concept of using strongly attenuated, randomly polarized light pulses for secure quantum communication has been around since the mid-1980s. Most commercial light sources for quantum communication are still based on this idea today. The biggest challenge here is to generate indistinguishable and…

No chiplets without heterogeneous integration: High-end performance packaging from wafer to system is one of the keys to hardware realization within the APECS pilot line. © Fraunhofer IZM

22.01.2025
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Electronics (wafers, semiconductors, microchips,...)

Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line

The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the development and integration of chiplet technologies as a means of making Europe’s semiconductor industry mor…

2-dimensional magnetic vector scanner. © Fraunhofer IPMS

22.01.2025
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Trade fair

Optical systems from Fraunhofer IPMS for medicine

High-precision images and lasers for faster, more precise therapies

Particularly in medicine and bioanalytics, results must be determined precisely and reliably. The optical systems of Fraunhofer IPMS enable position control and gentle analysis options, which realize precise results in the shortest amount of time. The versatile applications of micro scanners in medi…

Within the framework of the APECS pilot line, the R&D infrastructure for semiconductor technologies and applications will be further expanded in the coming years. © loewn / Bernhard Wolf

HT-Wafer during the manufacturing process. © Fraunhofer IMS / HT Wafer during the manufacturing process. © Fraunhofer IMS

15.01.2025
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Electronics (wafers, semiconductors, microchips,...)

Strengthening Semiconductor Technologies for Europe

Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line

As part of the Research Fab Microelectronics Germany (FMD), the Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) is playing a crucial role in the development of the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) pilot line. By contri…

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