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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

The cryogenic on-wafer prober at Fraunhofer IAF enables fully automatic characterization of up to 25 entire 200-mm or 300-mm wafers with devices for quantum computing. © Fraunhofer IAF Setup for RF characterization under cryogenic conditions. © Fraunhofer IPMS / Setup for RF-characterization under cryogenic conditions. © Fraunhofer IPMS The ARCTIC Consortium. © imec / The ARCTIC Consortium. © imec © imec
  • Science

Fraunhofer IPMS and IAF collaborate with 34 European partners in project ARCTIC

EU-project joins forces towards the era of scalable control technology for quantum processors

In order to make quantum computers usable, developing the control technology is at least as important for scaled systems, yet it is still in its infancy. Project ARCTIC brings together 36 international partners from industry, academia and leading RTOs to establish a complete and comprehensive Europe…

Si spin qubits, manufactured with state-of-the-art 300mm integration processes.
  • Electronics (wafers, semiconductors, microchips,...)

The results highlight the maturity of 300mm fab-based qubit processes ultimately enabling large-scale quantum computers.

Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announced the demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/√Hz at 1Hz. In view…

Employees of EV Group and Fraunhofer IZM-ASSID next to a fully automated EVG®850 DB UV laser debonding and cleaning system, installed in the newly opened Center for Advanced CMOS and Heterointegration Saxony (CEASAX) by Fraunhofer in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf
  • Electronics (wafers, semiconductors, microchips,...)

ST. FLORIAN, Austria and MORITZBURG, Germany Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)

EV Group and Fraunhofer IZM-ASSID expand partnership in Wafer Bonding for Quantum Computing applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…

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