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HJM MT-Messtechnik Systec & Solutions GmbH Piepenbrock



The space company Beyond Gravity is doubling the production area at its site in Berndorf, Austria. “We are seeing strong, sustained demand for our high-performance electrical propulsion pointing mechanisms, especially from customers in the U.S. and Europe,” says Wolfgang Pawlinetz, Vice President Thermal & Mechanisms at Beyond Gravity. © Beyond Gravity, Anna Rauchenberger. A Beyond Gravity APPMAX-3 pointing mechanism in the form of a robotic arm will control the SWISSto12 HummingSat electric spacecraft thruster. Copyright: Beyond Gravity. APPMAX2-XS is a next-generation electric propulsion pointing mechanism designed specifically for small satellites operating in Low Earth Orbit. © Beyond Gravity.
  • Conversion

The space company Beyond Gravity is doubling the production area at its site in Berndorf, Austria. From 2027 onwards, the company will be able to produce ten times more pointing mechanisms per year.

Beyond Gravity increases thruster pointing production capacity tenfold

Beyond Gravity, a leading global space supplier, is significantly expanding its production footprint in Austria to meet surging demand for mechanisms, which point electric satellite thrusters. “We are investing 4.5 million euros to double our production facility in Berndorf, Austria. This is a signi…

Main entrance at X-FAB's Erfurt site
  • New building

German federal government and Free State of Thuringia support key project for the future of Thuringia’s microelectronics location with Euro 127.4 million

Grant notification presented: X-FAB develops Erfurt site into a center for microsystems technology

A grant notification for Euro 127.4 million was presented today in Erfurt to X-FAB MEMS Foundry GmbH by Thuringia’s Minister President Mario Voigt, Thuringia’s Minister of Economic Affairs Colette Boos-John, and Erfurt’s Mayor Andreas Horn. The funding provided by the German federal government and t…

Figure 1 – Schematic comparison of (left) conventional via-middle and (right) local-BDI TSV approaches, assuming a cell height of 115nm and bulk Si thickness of 500nm. Figure 2 – Overlay dependence of the chain resistance of TSV/MOL-via structures, showing 30nm overlay window. The solid black line represents simulations; dashed lines represent ±5% CD.
  • Electronics (wafers, semiconductors, microchips,...)

The new integration approach implements sub-100nm self-aligned through-Si via connections, enabling low-resistance and low-leakage front-to-back connections with good overlay performance.

Sony and imec unveil high-density backside connectivity module enabling next-generation 3D chip integration

– Sony and imec introduce a novel module for integrating highly dense backside sub-100nm through-Si vias (TSVs), based on a self-aligned local backside dielectric isolation (local BDI) step.
– The resulting front-to-back TSVs have lower aspect ratio, 3x lower resistance, 3x larger overlay window, and…

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