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High-density MIMCAP in a 300mm silicon interposer High-density MIMCAP in a 300mm silicon interposer
  • Electronics (wafers, semiconductors, microchips,...)

Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding

– Imec is evolving its 300mm RF silicon interposer into a unique, system-level platform for the heterogeneous integration of III‑V chiplets on Si‑CMOS – targeting mmWave/sub‑THz wireless and high‑speed data center applications.
– A new MIMCAP architecture delivers a 10-to-100-fold increase in capacit…

DALUT31 Series: Four times the signal strength and improved signal-to-noise ratio. (Copyright: LASER COMPONENTS Germany GmbH)
  • Products, devices, systems, plants for applications

New detector technology suppresses ambient noise and amplifies the signal of interest

DALUT31 Series: Fourfold Signal Strength and Improved Signal-to-Noise Ratio

With the DALUT31 series, LASER COMPONENTS has developed pyroelectric differential detectors in voltage mode that offer the highest sensitivity while minimizing noise contributions. The company has further developed the design of the proven Advanced-LTO infrared detectors for this purpose. The new de…

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Vaisala Pfennig Reinigungstechnik GmbH Piepenbrock ClearClean