Speed and precision for SiP

The SIPLACE TX micron can now also be operated with the SIPLACE Tray Unit. New trays can be refilled during operation without interruption. (Copyright: ASMPT)

The SIPLACE TX micron is the convincing answer to the challenges in SiP production. The flexible platform combines the speed of SMT assembly with die processing. The new version of the placement machine has been significantly improved by the innovation and market leader ASMPT in terms of speed, placement accuracy, transport, and processing options. The hybrid system offers electronics manufacturers greater flexibility and thus clear competitive advantages for their Intelligent Factory.

SiPs (System in Package) combine active and passive electronic components into compact functional groups, for example for wireless modules in smartphones, wireless headphones, hearing aids, or smartwatches. The advanced packaging technology required for this assembles dies, individual unencapsulated semiconductor chips, as well as traditional SMT components. The high demand for such assemblies can only be met with machines that can process dies at speeds similar to those common in the SMT world, and with precision often found in die processing. Here, passive SMD components, which are placed very close together, often need to be assembled with high precision.

Two worlds and three precision classes on one machine

The ASMPT SIPLACE TX micron placement machine fully meets the increased demands of the industry. The precision has been further improved for this purpose. There are now three accuracy classes for advanced packaging available in one machine: 10 µm, 15 µm, and 20 µm, each with a process stability of 3 σ. Despite the improved basic accuracy from 25 µm to 20 µm, the placement performance reaches 93,000 BE/h, representing a 14% increase compared to the previous 20-µm class of the SIPLACE TX micron. At maximum placement accuracy (10 µm), the machine can process an unprecedented 62,000 components per hour in the industry, even with SiP mixed placements.

Processing larger components and boards

Thanks to larger vacuum tooling, substrates up to 300 x 240 mm can also be processed at 15 µm @ 3 σ. Also new is the high-resolution circuit board camera SST54 for smaller structures, reference marks, and barcodes, with significantly increased illumination power.

Additionally, a Longboard option is available for processing circuit boards up to 590 x 460 mm. A new optional multi-purpose transport system allows for the handling of circuit boards with carriers up to 20.5 mm height or bowing, as well as J-Bots and JEDEC trays as carriers. For production for highly demanding customers, such as the automotive industry, the optional traceability level directly from the belt will be highly valued.

Now also with SIPLACE Tray Unit

Important for fast and uninterrupted production: The SIPLACE TX micron can now also be operated with the SIPLACE Tray Unit. This works with tray magazines that can each hold two JEDEC trays — depending on the size of the components, up to 82 JEDEC trays or up to 41 wide trays measuring up to 355 mm x 275 mm are possible. The special feature: New trays can be refilled during operation without interruption. The magazine is divided into two zones: a buffer zone for ongoing supply and the main storage, where new trays are refilled.

Proven quality

Remaining in the new version are established features such as cost-saving detection of damaged or unusable components or the high-resolution vision system for components with blue light, which optimizes image contrast for particularly fine structures and balls. The SIPLACE TX micron is also certified according to ISO class 7 cleanroom standards as well as Semi S2/S8.

A safe investment

"ASMPT covers a wide range of areas with its product portfolio, both in die processing and in SMT components," explains Sylvester Demmel, Senior Product Manager at ASMPT. "Following the changing market requirements, it was only logical for us to combine these two worlds on one machine, thereby enabling electronics manufacturers more flexibility and competitive advantages for their Intelligent Factory. With its high precision and placement speeds, the new SIPLACE TX micron is a worthwhile and future-proof investment that pays off."