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- Electronics (wafers, semiconductors, microchips,...)
Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
– Imec is evolving its 300mm RF silicon interposer into a unique, system-level platform for the heterogeneous integration of III‑V chiplets on Si‑CMOS – targeting mmWave/sub‑THz wireless and high‑speed data center applications.
– A new MIMCAP architecture delivers a 10-to-100-fold increase in capacit…








