On 2nd March 2026 the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2nm, released two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) h…

When it comes to highly specialized, customer-specific positioning solutions, Steinmeyer is the go-to provider. Even in the semiconductor industry, the Dresden location in "Silicon Saxony" has long been considered an Eldorado for the seemingly impossible, as Saxony's experts master the most demandin…

At the Mogliano Veneto plant, the ALBA PCB Group has established a second Class 10,000 cleanroom, a constantly decontaminated environment designed to house the most advanced direct imaging technology for printed circuit boards.

The LDI Ledia system from the Japanese company Screen Research, which we h…

– Imec inaugurates Europe’s NanoIC pilot line with the official opening of a 2,000m² cleanroom expansion at its Leuven campus.
– Equipped with cutting-edge tools, including ASML’s High NA EUV tool, imec’s cleanroom is a cornerstone of the NanoIC initiative – pursuing sub-2nm chip technology.
– Exactly four…

An innovative microlaser concept based on so-called surface emitters (VCSEL) has been developed by the Department of "Optoelectronics and Quantum Devices" at TU Berlin under the leadership of Prof. Dr. Stephan Reitzenstein. The new microlasers are vertically structured laser diodes in which the uppe…

On 2nd February, 2026, the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2nm, announced the release of two new process design kits (PDKs): an A14 pathfinding PDK for advanced logic scaling and an eDRAM system explora…

Veeco Instruments Inc. (Nasdaq: VECO) and imec announced today that they have collaboratively developed a 300mm high volume manufacturing compatible process that enables the integration of barium titanate (BaTiO3 or BTO) on a silicon photonics platform. BTO is a promising material with unique electr…

The global demand for power electronics and chips for applications in automotive, communication, and industrial sectors continues to grow unabated. However, many of the production facilities originate from a different era: 200-mm wafer factories built in the 1990s and 2000s are still operating today…

Sensible electronics move perfectly – with the new suction cup material HT1-ESD from Schmalz. The material addresses several critical issues in electronics manufacturing simultaneously: it leaves hardly any marks on components, reliably protects against electrostatic discharges (ESD), and withstan…

Key Facts at a Glance

– evolast® sets a new benchmark for semiconductor purity: engineered to deliver ultra-low outgassing performance that safeguards process integrity in critical plasma, thermal, and chemical manufacturing environments.
– The most advanced low-outgassing elastomer: evolast® ensures…