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  • Lasertechnology

More contrast, less risk: "Black Marking" for medical technology

With UDI requirements according to FDA and MDR, direct marking is mandatory for many medical devices, including surgical instruments and implants. In practice, these requirements apply to highly reflective metals, extremely limited marking areas, and demanding conditions throughout the entire lifecy…

Stainless steel instrument with
Shiny metals, extremely small marking areas, and strict UDI requirements pose challenges for direct marking of medical devices. The technical article shows how ultrashort pulse lasers solve these through the marking effect "Black Marking."

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C-Tec Piepenbrock ClearClean Hydroflex
Arbeitsschutzrichtlinien 2026: Warum Edelstahl das Rückgrat der modernen Industrie ist. (Copyright: ULMA Lifting Solutions)
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  • Products, devices, systems, plants for applications

The industry is facing an unprecedented wave of regulation: efficiency alone is no longer sufficient. Companies must ensure safety for employees, seamless product integrity, and the sustainability of all equipment and processes.

Occupational Safety Guidelines 2026: Why Stainless Steel is the Backbone of Modern Industry

From the effective date of the latest updates to ISO 45001 to the tightening of industrial safety protocols (such as RD 302/2026), companies in sectors like the food and pharmaceutical industries face a fundamental paradigm shift, for which the choice of floor conveyors is a decisive factor.

1. Ergon…
Figure 1 – (a) Schematic of the 3-word-line based 3D CCD structure: bottom gate (BG), center gate (CG), and top gate (TG), with source (S) at the bottom and drain (D) at the top; (b) cross-sectional TEM image showing 3 gate layers with a word-line pitch of 80nm. Figure 2 – (a) Illustration of the pulsing scheme across 3 gates for serial charge transfer in a 3-word-line based 3D CCD memory; (b) Schematic of 3D CCD operation showing electron transfer through the formation and shifting of potential wells under the gates. Figure 3 – (a) I-f characteristics from 7 devices with varying memory hole (MH) diameters, measured up to 4MHz; (b) the number of electrons transferred per cycle obtained from the slope of the corresponding I-f curves.
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  • Electronics (wafers, semiconductors, microchips,...)

The feasibility of processing a charge coupled device (CCD) in a 3D NAND-like architecture paves the way for a cost-effective, high-bit-density memory solution to address the memory wall for AI specific workloads

Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications

– Imec presents the first 3D implementation of a charge coupled device (CCD) with indium-gallium-zinc-oxide (IGZO) channel, with potential for AI memory applications.
– Due to the cost-effective fabrication, high bit density, and block-addressable nature, the 3D CCD device shows promise to be used as…
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