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All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

The design pathfinding PDK allows for digital designs with 2nm Gate All Around (GAA) technology including backside connectivity.

11.02.2024
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Electronics (wafers, semiconductors, microchips,...)

The design pathfinding PDK lowers the threshold for academia and industry to access the most advanced semiconductor technologies

Imec Launches the First Design Pathfinding Process Design Kit for N2 Node

At the 2024 IEEE International Solid-State Circuits Conference (ISSCC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, launches its open process design kit (PDK) with a concomitant training program offered through EUROPRACTICE. The PDK will enable virt…

Von links nach rechts: Dr. Michael Heckmeier (CEO der Siltronic AG), Claudia Schmitt (CFO der Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) und Bernhard Schmidt (Siltronic Senior Vice President und Projektleiter) (Foto: © Siltronic AG) / From left to right: Dr. Michael Heckmeier (CEO of Siltronic AG), Claudia Schmitt (CFO of Siltronic AG), Niew Bock Cheng (Site President Siltronic Singapore) and Bernhard Schmidt (Siltronic Senior Vice President and Project Lead) (Photo: © Siltronic AG)

18.01.2024
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Electronics (wafers, semiconductors, microchips,...)

Siltronic AG produces first wafers in its new Singapore fab

On 7th November 2023 Siltronic announced the production of the first wafers in its latest state-of-the-art 300 mm fab in Singapore. The production marks an important milestone in the strategic capacity expansion of Siltronic’s global production network.

"It fills me with immense pride to see the produ…

Herzogenrath, 23.11.2023: Spatenstich zum Bau des neuen Innovationszentrums der AIXTRON SE am Standort Herzogenrath. V.l.n.r.: Dr. Christian Danninger, Finanzvorstand CFO AIXTRON SE, Dr. Benjamin Fadavian, Bürgermeister Stadt Herzogenrath, Dr. Felix Grawert, Vorsitzender des Vorstands CEO & President AIXTRON SE, Kim SChindelhauer, Aufsichtsratsvorsitzender AIXTRON SE, Franz-Josef Türck-Hövener, Technischer Beigeordneter Stadt Herzogenrath. (Foto: AIXTRON/F.Stark)

17.01.2024
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New building

The leading provider of deposition equipment to the semiconductor industry is investing around EUR 100 million at its headquarters in Herzogenrath, Germany. With this, AIXTRON is laying an important foundation for further successful growth.

AIXTRON starts construction of new innovation center

AIXTRON SE (FSE: AIXA, ISIN DE000A0WMPJ6) has officially started the construction of the new innovation center at its headquarters in Herzogenrath, Germany. The leading provider of deposition equipment to the semiconductor industry is investing around EUR 100 million in 1000m2 of clean room with add…

14.01.2024
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Automation

Fabmatics strengthens the cleanroom segment within the SCIO Group.

Deal closed: Fabmatics is officially part of SCIO Automation

When the deal closed on December 27, 2023, the takeover of Fabmatics GmbH by SCIO Automation GmbH, which was agreed on October 30, 2023, subject to official approvals, was completed. Headquartered in Dresden, Fabmatics is now officially part of international automation platform SCIO Automation (SCIO…

Konzeptbild der neuen Fab. © studiobrand.3dvisuals / Concept image of the new high-tech fab. © studiobrand.3dvisuals

11.01.2024
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Electronics (wafers, semiconductors, microchips,...)

Investment in new production tool for the semiconductor equipment industry.

State-of-the-art electron beam lithography system for Jenoptik’s high-tech fab in Dresden

Jenoptik is investing a low double-digit million-euro amount in a state-of-the-art system for the high-tech fab currently under construction in Dresden. The new electron-beam lithography system (E-Beam) will be used to manufacture high-precision micro-optical components for customers in the semicond…

Nicht geeignet für sensible Produktionsbereiche - Kupferabrieb von Schleifkontakten kann ganze Chargen kontaminieren. / Not suitable for sensitive production areas – copper abrasion from sliding contacts can contaminate entire batches.

Mit der induktiven Ladetechnik können AMR nun auch in Reinräumen der ISO-Klasse 4 eingesetzt werden. / Using inductive charging technologies, AMRs can now also be used in ISO Class 4 cleanrooms.

13.11.2023
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Automation

Wireless Charging Obtains ISO Certificate for Cleanroom

It is now possible to automate transport processes with automated guided vehicles (AGV) and autonomous mobile robots (AMRs) in cleanrooms – thanks to Wiferion’s etaLINK 3000 inductive charging system. The wireless charging solution has been certified for ISO Class 4 by the Fraunhofer Institute f…

Der 6-Achs-Manipulator von Steinmeyer Mechatronik realisiert hochgenaue Ausrichtprozesse in der Halbleiterinspektion. (Bild: Steinmeyer Mechatronik GmbH)

26.10.2023
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Electronics (wafers, semiconductors, microchips,...)

Hochgenaue Ausrichtung von Wafern und Optiken

6-Achs-Manipulator für die Halbleiterinspektion

Der 6-Achs-Manipulator von Steinmeyer Mechatronik kombiniert einen Kreuztisch mit einem Tripod und erzielt dadurch ein Höchstmaß an Präzision, Steifigkeit und Kompaktheit. Eine ideale Lösung für hochgenaue Inspektionssysteme in der Halbleiterindustrie.

Vor dem Vermessen bzw. Bearbeiten müssen Wafer und O…

20.07.2023
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ESD

Kompaktes Ionisationsgebläse

Das kompakte Gebläse der Simco-Ion Micro-Serie wurde speziell für anspruchsvolle Anwendungen in kritischen Umgebungen entwickelt, bei denen der Platz knapp ist. Das neue Mikrogebläse 5941 erfüllt die aktuellen Anforderungen an moderne und automatisierte Produktionsprozesse. Mit einer Höhe von n…

eBeam-Metrologiegeräte von Applied Materials im Reinraum des Fraunhofer IPMS. © Fraunhofer IPMS / Applied Materials’ eBeam metrology equipment at cleanroom of Fraunhofer IPMS. © Fraunhofer IPMS

19.07.2023
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Electronics (wafers, semiconductors, microchips,...)

Launch of European Semiconductor- Metrology Technology Hub

Applied Materials and Fraunhofer IPMS launch European Semiconductor- Metrology Technology Hub

– New hub will provide state-of-the-art metrology systems to accelerate semiconductor research and enhance development projects with chipmakers and ecosystem partners across Europe, particularly in ICAPS* market segments
– Collaboration to accelerate learning, develop novel methods and prove new me…

01.07.2023
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Electronics (wafers, semiconductors, microchips,...)

ASML is making a substantial commitment in imec's future state-of-the-art pilot line

Imec and ASML sign Memorandum of Understanding (MoU) to support semiconductor research and sustainable innovation in Europe

Imec, a leading research and innovation hub in nanoelectronics and digital technologies, and ASML Holding N.V. (ASML), a leading supplier to the semiconductor industry, today announce that they intend to intensify their collaboration in the next phase of developing a state-of-the-art high-numerical…

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