What do the speakers say in advance about their presentations?

TE Connectivity - Volker Seipel, Manager Platform Element Engineering Core Technologies:

"Electrical stamp contacts become contaminated with oils and other fluids during the manufacturing process. The presentation describes the impact these contaminations can have and how TE provides process-safe products. The conference represents a forum for me to mainly network and learn."

HMT - Häseler Metall Technik - Dominik Falk, Head of Surface Technology Division:

"The topic of filmic contamination has been a major issue in our company for a long time. For this reason, we are always looking for suitable measurement methods. When we find promising methods, we test them internally and compare them to current practices. This quickly shows how suitable the method already is or what potential it has and where further development is needed.

I look forward to the event, as it is unique in the industry. The technical conference brings together OEMs and the entire supply chain. The nice thing is that everyone discusses on equal footing, sharing a lot of technical knowledge, learning about new trends, and exchanging practical examples and implementations."

Witzenmann GmbH - Andrea Krause, Department of ti-ts Development Technical Cleanliness:

"Various auxiliary and operational materials are used in the manufacturing process, which are necessary for the process to function at all. Unfortunately, these are not always free of 'side effects' and can cause serious disruptions in subsequent process steps. This sounds dramatic but is manageable, as anomalies are usually detected promptly. This issue can be minimized through appropriate cleaning steps. The same generally applies to assembly by the customer, who defines the relevant requirements for the product.

It is more difficult to prevent unwanted effects during later operation. For this, it is necessary to know all substances that can come into contact with the product during the process, either planned or accidental. To assess potential risks during use, operating conditions must be considered. Harmless residues from manufacturing can decompose under operational conditions and release aggressive substances. This requires a holistic view beyond our own process and close collaboration with customers.

I will demonstrate with an example how complex the involved substances and their 'side effects' can be and how simulation can help assess the risk potential."

nanoAnalytics - Dr. Andreas Schäfer, Managing Director and Laboratory Head:

"My presentation will focus on the application possibilities of laboratory analytics in the field of filmic contamination and how to characterize filmic impurities as accurately as possible. Often, it is mainly about identifying the substances involved. In other cases, the lateral distribution or the occupancy strength should be examined. Besides a brief general introduction, the focus will be on examples. I am naturally looking forward to meeting old acquaintances at this conference, but especially to making new contacts. The field in which filmic contamination plays a role is very broad. Therefore, at events on this topic, one almost inevitably makes new, interesting contacts."

Carl Zeiss SMT - Dr. Roland Steiner, Director of Cleaning Technology:

"I will present how filmic contamination (among others) already plays an important role in the manufacturing of lithography systems. It is crucial that the detection, prevention, and ultimately the removal of such contamination occurs during manufacturing and throughout the entire supply chain. I will address aspects of process development within ZEISS's Semiconductor Manufacturing Technology (SMT) division."

OHB Systems - Dr. Axel Müller, Cleanliness Engineer:

"My presentation concerns specifically chemical film-forming cleanliness requirements in spaceflight. When tasked with guaranteeing high-resolution imaging or spectroscopy of Earth from 36,000 km away, special precautions regarding cleanliness in design, material selection, and application methods are understandable. Furthermore, maintenance-free operation entails particularities in process safety (bonding), which impose requirements on surface cleanliness and detection methods. These two aspects will be highlighted and aim to promote cross-industry knowledge exchange."

OLYMPUS EUROPE - Markus Fabich, Vertical Market Specialist Manufacturing Scientific Solutions Division:

"In principle, (fluorescence) microscopy is a recognized state of the art. Still, 'simple' is not the word many would use. I am convinced I can convey how modern FL microscopy makes routine contamination testing easier and more reliable. It might even be possible to provide insights into UV videoscopy and the current state of X-ray fluorescence analysis."

CSC JÄKLECHEMIE - Dr. Martin Hanek, Business Development (ST/E) Head of Surface:

"The title of my presentation is: Using strengths of wet cleaning processes. I will address the practically relevant aqueous and solvent-based cleaning methods. It is about the strengths and weaknesses of each cleaning process and how to leverage these strengths to achieve an optimal result.

Clean as necessary, but as good as possible! This is my first participation in this technical conference. I look forward to interesting presentations, stimulating discussions, and challenges related to component cleaning."