New year, new job? View the vacancies! More ...

All publications for the rubric Electronics (wafers, semiconductors, microchips,...)

Figure 1 – (a) Schematic of the 3-word-line based 3D CCD structure: bottom gate (BG), center gate (CG), and top gate (TG), with source (S) at the bottom and drain (D) at the top; (b) cross-sectional TEM image showing 3 gate layers with a word-line pitch of 80nm.

Figure 2 – (a) Illustration of the pulsing scheme across 3 gates for serial charge transfer in a 3-word-line based 3D CCD memory; (b) Schematic of 3D CCD operation showing electron transfer through the formation and shifting of potential wells under the gates.

Figure 3 – (a) I-f characteristics from 7 devices with varying memory hole (MH) diameters, measured up to 4MHz; (b) the number of electrons transferred per cycle obtained from the slope of the corresponding I-f curves.

23.05.2026
‌
Electronics (wafers, semiconductors, microchips,...)

The feasibility of processing a charge coupled device (CCD) in a 3D NAND-like architecture paves the way for a cost-effective, high-bit-density memory solution to address the memory wall for AI specific workloads

Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications

– Imec presents the first 3D implementation of a charge coupled device (CCD) with indium-gallium-zinc-oxide (IGZO) channel, with potential for AI memory applications.
– Due to the cost-effective fabrication, high bit density, and block-addressable nature, the 3D CCD device shows promise to be used as…

22.05.2026
‌
3D printing

Less CO₂ emissions, no toxic chemicals: Fraunhofer IPT develops a new process chain for functionalized thin glass

The Fraunhofer Institute for Production Technology IPT in Aachen, together with project partners, has developed a process chain for manufacturing 3D thin glass with functionalized surfaces. The process chain combines laser structuring with subsequent forming and reduces energy consumption as well as…

21.05.2026
‌
Electronics (wafers, semiconductors, microchips,...)

Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosy…

17.05.2026
‌
Products, devices, systems, plants for applications

Optical wafer-level characterization of MEMS dynamics with automatic wafer map processing, recipe control, and cleanroom integration into fab-controlled workflows.

Fully automated MEMS vibration analysis in cleanroom: Polytec Micro System Analyzer now with ISO-3 certification and script automation

With the Micro System Analyzers (MSA-600, MSA-650 IRIS, MSA-100-3D), Polytec has been addressing contactless characterization of MEMS dynamics and topography for years – from individual dies to wafer-level testing on probe stations. The current expansion combines this optical measurement technology…

Researcher at Fraunhofer THM inserting a wafer into the transfer chamber of a deposition/etching cluster for structuring using atomic layer etching. © Daniel Karmann / Fraunhofer IISB

Optical ring resonator with a diameter of 200 μm on a SiC substrate. © Pascal Del’Haye / MPL

Cross-section of a photonic structure in silicon carbide (SiC on Insulator, SiCOI). © Pascal Del’Haye / MPL

07.05.2026
‌
Know How, Institute

Atomic layer processing for silicon carbide-based quantum photonic circuits

Microphotonics meets microelectronics

Silicon carbide (SiC) is a promising material platform for photonic integrated circuits (PICs) and miniaturized solid-state quantum systems. In the ALP-4-SiC project – Atomic Layer Processing for SiC for Applications in Photonics and Quantum Communication – researchers from the Max Planck Institute…

19.04.2026
‌
Know How, Institute

New impulses for industrial micro-manufacturing: Prof. Dr. Erica Lilleodden heads the business unit at Fraunhofer ISIT

Fraunhofer ISIT strengthens its expertise in microfabrication: Prof. Dr. Erica Lilleodden takes over the leadership of the Microfabrication Processes business unit. The materials scientist brings international experience from research and institute management. At ISIT, she develops manufacturing pro…

Illustration of HfO₂-based ferroelectric devices enabling scalable, CMOS-compatible non-volatile memory. The architecture supports integration in both front-end (FeFET) and back-end memory structures, while opening pathways to advanced ferroelectric functionalities such as multiferroic, pyroelectric, and tunable RF devices. © Fraunhofer IPMS

17.04.2026
‌
Electronics (wafers, semiconductors, microchips,...)

CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange For Ferroelectric Memory Materials Within the FAMES Pilot Line

CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European platform for advanced embedded non-volatile memory technologies. Launched in December 2023 and coordin…

Fraunhofer IPMS plays a central role within SPINS in the high-resolution structuring of qubit and processor elements. © Fraunhofer IPMS

14.04.2026
‌
Union, Association, Cluster

EU is funding SPINS with an amount of € 50 million

Semiconductor-based Quantum Pilot Line ‘SPINS’ launched with EU support

In April, ‘SPINS’ (Semiconductor Pilot line for Industrial Quantum NanoSystems) was launched, one of the 6 European quantum pilot lines. Coordinated by imec, the consortium brings together 25 European RTOs, industry partners, and academic research groups to strengthen Europe’s leadership and soverei…

A look inside imec's 300mm cleanroom. (Photo: Imec)

10.04.2026
‌
Union, Association, Cluster

Semiconductor-based Quantum Pilot Line ‘SPINS’ launched with EU support

On April 2, 2026, SPINS (Semiconductor Pilot line for Industrial Quantum NanoSystems) was inaugurated, one of six European quantum pilot lines. The consortium coordinated by imec brings together 25 European research institutions, industry partners, and academic research groups to strengthen Europe's…

23.03.2026
‌
Electronics (wafers, semiconductors, microchips,...)

A major milestone in propelling industry into the ångström era

Imec receives the world’s most advanced High NA EUV system

– Imec announces the arrival of the ASML EXE:5200, the world’s most advanced High NA EUV lithography system, in its 300mm cleanroom in Leuven.
– Operating the High NA EUV system in direct connection with state-of-the-art metrology and patterning equipment/materials accelerates learning cycles to unl…

A look at the NEWSLETTER

Better informed: With YEARBOOK, NEWSLETTER, NEWSFLASH, NEWSEXTRA and EXPERT DIRECTORY

Stay up to date and subscribe to our monthly eMail-NEWSLETTER and our NEWSFLASH and NEWSEXTRA. Get additional information about what is happening in the world of cleanrooms with our printed YEARBOOK. And find out who the cleanroom EXPERTS are with our directory.