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- Electronics (wafers, semiconductors, microchips,...)
New advanced interconnect PDKs pave the way for high‑density, energy‑efficient chip‑to‑chip integration.
NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
On 2nd March 2026 the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2nm, released two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) h…








