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- Transport
Why internal logistics are no longer a secondary topic in pharmaceutical companies.
GMP-compliant in-house logistics: Requirements for internal transport processes
In pharmaceutical companies, GMP requirements are often related to production, documentation, and quality assurance. At the same time, internal transportation processes are increasingly coming into focus. This is because samples, raw materials, release documents, consumables, laboratory equipment, r…
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- People
Norbert Otto concludes his active role at SwissCCS
A chapter comes to an end
For many years, Norbert Otto was part of the SwissCCS association. It was not easy for him to say goodbye to his active role. After over 30 years in the SwissCCS association, the moment had come. "At 71 years old, this step is not entirely easy—and yet it feels right," says Norbert Otto. His connect…
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- New building
German federal government and Free State of Thuringia support key project for the future of Thuringia’s microelectronics location with Euro 127.4 million
Grant notification presented: X-FAB develops Erfurt site into a center for microsystems technology
A grant notification for Euro 127.4 million was presented today in Erfurt to X-FAB MEMS Foundry GmbH by Thuringia’s Minister President Mario Voigt, Thuringia’s Minister of Economic Affairs Colette Boos-John, and Erfurt’s Mayor Andreas Horn. The funding provided by the German federal government and t…
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- Electronics (wafers, semiconductors, microchips,...)
The new integration approach implements sub-100nm self-aligned through-Si via connections, enabling low-resistance and low-leakage front-to-back connections with good overlay performance.
Sony and imec unveil high-density backside connectivity module enabling next-generation 3D chip integration
– Sony and imec introduce a novel module for integrating highly dense backside sub-100nm through-Si vias (TSVs), based on a self-aligned local backside dielectric isolation (local BDI) step.
– The resulting front-to-back TSVs have lower aspect ratio, 3x lower resistance, 3x larger overlay window, and…
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- Trade fair
Ilmac Lausanne 2026 puts the laboratory of the future, AI and biotools centre stage
On 23 and 24 September 2026, Expo Beaulieu Lausanne will become the meeting point for Switzerland’s chemistry and life sciences sector. Ilmac Lausanne 2026 is expected to attract around 200 exhibitors and 3,500 trade visitors. At its core will be a conference programme featuring over 70 presentation…
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- Trade fair
Between 29 September and 1 October 2026, POWTECH TECHNOPHARM will bring together experts from a wide range of process industries in Nuremberg and create the ideal conditions for knowledge-sharing and innovation.
POWTECH TECHNOPHARM 2026: Competitive advantages through cross-industry exchange
Between 29 September and 1 October 2026, POWTECH TECHNOPHARM will bring together experts from a wide range of process industries in Nuremberg and create the ideal conditions for knowledge-sharing and innovation. As the gateway to technologies used in processing powders, solids and liquids, the Exhib…
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- Transport
Innovative AGV concepts automate spare parts supply in the semiconductor industry in Silicon Saxony
LOGSOL sets standards for material logistics in cleanrooms
In "Silicon Saxony," sustainable European supply chains for microelectronics are emerging. A leading manufacturer is expanding its capacities and will soon produce in a new high-tech plant. Marcel Richter and Markus Störzel from LOGSOL were on site at the navigation center of the new factory, the cl…
