The development of ion implantation in the 1960s was one of the fundamental prerequisites for the production of highly integrated circuits as we know them today. The process is used to introduce foreign atoms into a semiconductor and thus, for example, change its conductivity (doping). At the Ferdin…

At the Hannover Messe on March 31, 2025, the launch of the new "Chiplet Application Hub" of the FMD took place. As a node for the development and application of chiplet technologies, it bridges research and industrial use. Together with industry, it advances the development of "made in Germany" chip…

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, S…