Mini environments are a critical success factor in 300 mm wafer manufacturing – especially in the delicate balance between standardized platforms and highly specialized custom solutions. At the same time, the requirements for process stability, material compliance, and cleanroom performance are continuously increasing.

Our roundtable on September 29, 2026, will focus on this topic:
"Mini environments between standardization and custom design – solutions and challenges in 300 mm wafer manufacturing"

The focus will include, among other things:

– History of mini environments in 300 mm wafer manufacturing
– Tasks and requirements for a mini environment
– Examples of various design solutions
– Material requirements as well as relevant guidelines and standards
– Cleanroom technical acceptance measurements

Take the opportunity to exchange ideas, discuss concrete solutions, and gather impulses for your own applications.

Date: September 29, 2026
Time: 4:30 PM | Arrival from 4:00 PM
Speaker: Christoph Hocke
Infineon Technologies Dresden AG & Co. KG
Location: live or digital

What you can expect at the roundtable

The cleanroom roundtable is intentionally designed to be practical. The focus is on concrete applications and peer-to-peer exchange.

Secure your spot now

– Register now and quickly secure your place, as the number of participants on-site is limited.
– Participation is possible both on-site and digitally.

If you have any questions, please contact: marketing@colandis.com

Unfortunately, you cannot attend in person on this day? Feel free to forward this invitation to a colleague or supplier who might find this topic interesting.

Please note that we charge a small fee of €15 (including VAT) for on-site participation. Beverages and a small snack are provided.

We look forward to your participation.

Your COLANDIS Team