On 2nd March 2026 the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies beyond 2nm, released two first-of-a-kind advanced interconnect process design kits (PDKs): a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) h…

Together with the consulting firm P3, the Fraunhofer IPA has investigated how component manufacturers could benefit from producing hardware parts for humanoid robots. The results are available free of charge in the white paper "The Humanoid Hardware Value Chain: Can the European Manufacturing Indust…

The work at the SMC Campus in Egelsbach is progressing on schedule. Over an area of approximately 32,700 square meters, a modern site is being developed that combines product development and the implementation of customized customer solutions under one roof. With the current construction phase, the…