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Vaisala Becker Pfennig Reinigungstechnik GmbH Buchta



Figure 1 – (Left) Transfer curves of 2D-pFET devices using defect-passivated synthetically-created bi-layer WSe2 films, with the best device showing Imax = 690µA/µm; (Right) TEM cross-section of the finalized dual-gated 2D pFET (Lch=channel length; TG=Top Gate; BG=Back Gate; S=Source; D=Drain; IL=Interlayer), in collaboration with TSMC. Figure 2 – (a) Dry etching into SiO₂; (b) Dry and wet etching, which stops selectively on the WS₂ monolayer channel, also removing the AlOx interlayer laterally along the entire channel length (in collaboration with Intel).
  • Electronics (wafers, semiconductors, microchips,...)

Collaboration with leading semiconductor manufacturers pivotal in optimizing the key modules for 2D-material device integration

Imec advances 2D-material based device technology beyond state of the art in support of the future logic technology roadmap

– Imec, in collaboration with leading semiconductor manufacturers, addressed key challenges in advancing 2D-material device technology, which is considered a long-term option for extending the logic technology roadmap.
– Collaboration with TSMC resulted in record performing WSe2 -based pFETs (with Im…

3 Steps 10 common mistakes
  • Disinfection | procedures, devices, agents, media (Wipers, Swaps,...)

Cleanroom cleaning and disinfection in practice: 10 common mistakes that increase risks – and how to avoid them

10 common mistakes in cleanroom cleaning and disinfection

Wenn es um GMP geht, stehen meist Herstellprozesse, Validierungen oder Qualifizierungen im Mittelpunkt. Die Reinigung taucht in vielen Betrieben eher am Rand auf – als Routineaufgabe, die „mitläuft“.

Aber was denken Sie – wie viele GMP-Abweichungen hängen tatsächlich mit Reinigung zusammen?

Die Antwor…

Imec pioneers full wafer-scale (300mm) production of solid-state nanopores with EUV lithography, as shown in the photo. © imec Cross-sectional and top-view TEM of the fabricated solid-state nanopore. Cross-sectional and top-view TEM of the fabricated solid-state nanopore.
  • Electronics (wafers, semiconductors, microchips,...)

Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

1. Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation transforms nanopore technology from a lab-scale concept into a scalable platform for biosensing, genomics and proteomics.
2. Nanopores are hailed as gamech…

The customer-specific planning, documentation, and commissioning of the automation solution for the cleaning system, as well as its integration into existing production lines, complete the range of services offered. (Photo: acp systems AG) The scalable quattroClean snow jet process is also used for cleaning Front-Opening Unified Pods (FOUP) to ensure the cleanliness of wafers in semiconductor manufacturing during storage and transport. (Photo: acp systems AG) For process interpretation and determination of the application-specific optimal cleaning parameters, the manufacturer has its own cleanroom technical center. (Photo: acp systems AG) The dry, resource-saving quattroClean snow jet technology meets the high cleanliness requirements in electronics manufacturing in a stable and reproducible manner. Here is an application from medical technology in which both a chip and its packaging are cleaned. (Photo: acp systems AG)
  • Cleaning | procedures, devices, agents, media (Wipers, Swaps,...)

quattroClean snow jet technology - dry and production-integrated cleaning

Sustainable and efficient solutions to cleaning challenges faced by electronics and semiconductor manufacturers

The electronics and semiconductor manufacturing industries face a number of challenges. Increasingly smaller structure sizes, rising demands concerning the power density, dependability and safety of electronic components, as well as new manufacturing technologies call for greater precision and highe…

Laser development at TRUMPF (Photo: TRUMPF)
  • Electronics (wafers, semiconductors, microchips,...)

Development of quantum algorithms // Joint project between TRUMPF, Fraunhofer Institute for Laser Technology ILT, and FU Berlin // Aiming to increase efficiency in laser technology

Research project: TRUMPF aims to improve its lasers with quantum computers

The high-tech company TRUMPF, the Fraunhofer Institute for Laser Technology ILT, and the Dahlem Center for Complex Quantum Systems at the Department of Physics at Freie Universität Berlin are researching the fundamentals of laser physics with the help of quantum algorithms. The long-term goal is to…

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