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Technical cleanliness 2020
11th Specialist Congress
Often barely visible particles are the cause of system failures in the production chain of the automotive, mechanical engineering, and medical industries. How to identify these particles, clean components correctly, and keep production processes technically clean is the focus of experts in quality management and technical cleanliness. As industry demands grow significantly, but costs need to be kept under control, industry and research experts meet annually to exchange ideas on current challenges and innovations. The major industry event on Technical Cleanliness takes place on May 12 and 13, 2020, in Bad Gögging near Ingolstadt, including a plant tour at Continental. The moderation is once again handled by Andreas Grossmann, an expert in Technical Cleanliness.
Hans Illig from Caterpillar discusses the pitfalls in implementing TecSa. Michael Klepzig from Continental explains the successful integration of a systematic “TC Monitoring” into manufacturing processes. How do I start with TecSa correctly in my company? Fabian Notter from STIHL answers this question. Rainer Oppelt, plant coordinator for TecSa at Bosch in Bamberg, sheds light on the current cleanliness strategy. Frank Krökel from INTERCEPT Technology presents modern functional packaging for clean goods and addresses the optimized global transport of components with TecSa requirements.
Dr. Andrea Hohmann and Christoph Tammer from Fraunhofer IGCV evaluate the resource expenditure of cleaning technologies in industrial production. Dr. Markus Rochowicz from Fraunhofer IPA informs about the new working group: Precision REM-EDX and the definition of the associated material classes for particle analysis, an addition to VDA 19.1. Afterwards, participants can either join the factory tour at Conti or choose from one of the workshops on fundamentals of Technical Cleanliness, e-mobility, measurement technology, product development process, cleaning, or assembly cleanliness. The evening event focuses on maintaining and expanding the network.
The second day of the congress opens with Thomas Rosemann, Head of the Materials Laboratory at the Würzburg plant, with the topic: Inline Particle Analysis of a Gear Oil Pump to Determine Technical Cleanliness in Series Production. Yasemin Müller from CleanControlling discusses the challenges of microscopic re-inspection. Johannes Kaindl from Zeiss presents new technologies for analyzing Technical Cleanliness. Manfred Hermanns from Ecoclean talks about dry cleaning of electric motors and their individual parts. Stefan Haupt, Manufacturing Manager at CLEAR & CLEAN, informs about wiping cleaning of sensitive surfaces. Christian Siegert from LPW Cleaning Systems discusses precision cleaning through validated processes.
Birgit Fruggel, Senior Expert in Technology at Schaeffler, talks about logistics and packaging, especially internal transport, cleanliness of reusable packaging, and the proper handling of damages to packaging. Joachim Ludwig, Managing Director of Colandis, and Bernd Albinus, site manager at Schenker, discuss cleaning and packaging of individual parts and assemblies for use in cleanroom conditions. Mathias Kögel, Managing Director of Kögel, focuses on the closed process chain during the entire logistics cycle for seamless cleanliness. The 11th Technical Cleanliness Congress concludes at 4:30 PM in Bad Gögging.
Get up to date and efficiently expand your network. It’s worth it: compact two days, current information firsthand, high-quality business contacts. You will meet top experts from Audi, Arnold Umformtechnik, Avia Bantleon, Bosch, BMW, Brose, Caterpillar, CEC, Continental, CleanControlling, Clear&Clean, Colandis, Fraunhofer IGCV, Fraunhofer IPA, Fraunhofer IPM, Ecoclean, Intercept, Kögel, LPW Cleaning Technology, LTB Laser Technology Mann+Hummel, Petrofer Chemicals, Porsche, Schaeffler, Schenker, STIHL, Volkswagen, Zeiss, ZF Friedrichshafen, and many more.
11th Industry Congress
Technical Cleanliness
May 12 and 13, 2020, in Bad Gögging near Ingolstadt
Including plant tour at Conti TEMIC microelectronic
Including exhibition, workshops, and speed networking
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Germany
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email: ingo.martin@sv-veranstaltungen.de
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