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Hydroflex Piepenbrock Buchta HJM



  • Electronics (wafers, semiconductors, microchips,...)

Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosy…

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C-Tec Systec & Solutions GmbH Becker Pfennig Reinigungstechnik GmbH