Many innovative European companies working on edge AI technologies have, until now, been dependent on international supply chains. To reduce this dependence, research organizations from four EU countries – including Fraunhofer – are setting up a European pilot line for next-generation edge AI techno…
With a festive event and a symposium on 24 June 2025, Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) celebrated 15 years of success in its field. Since its foundation in 2010, the Fraunhofer IZM’s Saxon site has become a globally respected engine of innovation in 3D system integration…
The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the development and integration of chiplet technologies as a means of making Europe’s semiconductor industry mor…
![Employees of EV Group and Fraunhofer IZM-ASSID next to a fully automated EVG®850 DB UV laser debonding and cleaning system, installed in the newly opened Center for Advanced CMOS and Heterointegration Saxony (CEASAX) by Fraunhofer in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf](/uploads/images/_scale/dsc4037klein_169_626x352.jpg "Employees of EV Group and Fraunhofer IZM-ASSID next to a fully automated EVG®850 DB UV laser debonding and cleaning system, installed in the newly opened Center for Advanced CMOS and Heterointegration Saxony (CEASAX) by Fraunhofer in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf / EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding and cleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. [From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group), Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Manuela Junghähnel, Site Manager (Fraunhofer IZM-ASSID), Markus Wimplinger, Corporate Technology Development & IP Director (EV Group), Andreas Pichler, Regional Sales Manager Europe (EV Group), Robert Wendling, Technical Assistant Wafer Bonding (Fraunhofer IZM-ASSID), Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID)]. © Fraunhofer IZM | Silvia Wolf")
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer IZM that provides world-leading applied research in semiconductor 3D wafer…
The future of microelectronics faces exciting developments and important trends. But how will this technological sector develop in the coming years? Which application areas will significantly drive 2.5D/3D hetero-integration and high-end performance packaging, and where are the limits of what is phy…
During pregnancy, regular medical check-ups provide information about the health and development of the pregnant person and the child. However, these examinations only provide snapshots of their state, which can be dangerous, especially in high-risk cases. To enable convenient and continuous monitor…
Imagine a scenario where you simply just throw in a pill to identify an error—this is now one step closer to reality thanks to the work done by researchers at Fraunhofer IZM in cooperation with Micro Systems Technologies (MST) and Sensry GmbH. As small as a piece of candy, the waterproof IoT sensor…
Since the arrival of COVID 19, PCR and other antigen tests have turned from sophisticated tools known only to medical professionals into an everyday experience for all of us. To mark the successful completion of their research on the PoC-BoSens platform, the international project consortium led by F…
Stay up to date and subscribe to our monthly eMail-NEWSLETTER and our NEWSFLASH and NEWSEXTRA. Get additional information about what is happening in the world of cleanrooms with our printed YEARBOOK. And find out who the cleanroom EXPERTS are with our directory.
