New building Waferfab 200 mm in Reutlingen

To 18.03.2010 the new 200 mm semiconductor manufacturing Robert Bosch GmbH was solemnly inaugurated. For opening Federal President Horst K�hler and the Prime Minister of the country Baden-Wuerttemberg held a Ansprache.Am location Reutlingen manufactures Robert Bosch GmbH in the future electronic circuits and sensors with most modern technology achievements (carriage return character): Technical building equipment, clean-room technology, Reinstmedienversorgung, Hook UP planning

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