6. Specialist Conference: Cinematic Pollution

© Süddeutscher Verlag Events

© South German Publishing Events

The process quality in many productions critically depends on the consistent handling of filmic contamination. Clean surfaces are a fundamental prerequisite for the usability of components. This demands process and quality planning throughout the entire process chain. In addition to cleaning technology as a quality gate between preliminary and subsequent processes, technical cleanliness in the production environment has come into focus from the perspective of cross-contamination.

The benchmark for this consideration is the respective level of required cleanliness at the right time and place in the final function. Not only oil, grease, and liquid traces are in focus, but increasingly also pigment and micro-deposits at the nanometer scale.

Under the keyword "Cleanability," a new set of requirements for production processes has developed in recent years. Here, the focus is on indirect contamination in the nano- and atomic-range, which is summarized under the term high purity processes.

Our conference offers exciting insights on both days into dealing with filmic contamination in the classic production processes of coating, bonding, and component processing. On the first day of the conference, analysis and cleaning techniques for the new high purity processes will be extensively presented through practical examples.

Thematic Focus:

– Specification of cleanliness (limits, standards, standardization)
– Innovative measurement technology and procedures
– Cleaning processes (e.g., liquid-based, dry...)
– Cleaning methods for filmic contamination (e.g., in electronic assemblies)
– Process control and management – requirements for the process chain in theory and practice
– Cleanliness requirements and cleaning procedures in joining processes [bonding, coating, painting, (ultrasound) welding]
– Damage patterns
– High purity requirements and their impact on cleaning and accompanying processes
– Pre-series development and new requirements for prototypes considering manufacturing processes/supply chains
– Packaging and logistics