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Fraunhofer IPMS closes gap in the characterization of organic semiconductors

Revolutionary chips for materials research

Neuer Messadapter für die gleichzeitige Kontaktierung von bis zu acht Interdigitalelektrodenpaaren. © Fraunhofer IPMS / New measurement adapter for simultaneous contacting of up to eight interdigital electrode pairs. © Fraunhofer IPMS
Neuer Messadapter für die gleichzeitige Kontaktierung von bis zu acht Interdigitalelektrodenpaaren. © Fraunhofer IPMS / New measurement adapter for simultaneous contacting of up to eight interdigital electrode pairs. © Fraunhofer IPMS
Explosionszeichnung des Messadapters mit Position des AX1580 Chips. Die roten Buchsen kontaktieren das Gate, die SMA-Buchsen kontaktieren je ein Source-Drain-Paar. © Fraunhofer IPMS / Exploded view of the measurement adapter showing the position of the AX1580 chip. The red sockets connect to the gate, while the SMA sockets each connect to a source-drain pair. © Fraunhofer IPMS
Explosionszeichnung des Messadapters mit Position des AX1580 Chips. Die roten Buchsen kontaktieren das Gate, die SMA-Buchsen kontaktieren je ein Source-Drain-Paar. © Fraunhofer IPMS / Exploded view of the measurement adapter showing the position of the AX1580 chip. The red sockets connect to the gate, while the SMA sockets each connect to a source-drain pair. © Fraunhofer IPMS
Chip AX1580, 15x15 mm2, mit 8 Gold-Interdigitalelektrodenpaaren mit einer Kanalweite von 10 mm und Kanallängen von 2,5; 5, 10 und 20 µm. Der Chip selbst kann als Gateelektrode genutzt werden, das Gateoxid zwischen Gate und den Interdigitalelektroden ist typisch SiO2 mit einer Dicke von 230 nm. © Fraunhofer IPMS / Chip AX1580, 15x15 mm², with 8 gold interdigital electrode pairs with a channel width of 10 mm and channel lengths of 2.5, 5, 10, and 20 µm. The chip itself can be used as a gate electrode; the gate oxide between the gate and the interdigital electrodes is typically SiO2 with a thickness of 230 nm. © Fraunhofer IPMS
Chip AX1580, 15x15 mm2, mit 8 Gold-Interdigitalelektrodenpaaren mit einer Kanalweite von 10 mm und Kanallängen von 2,5; 5, 10 und 20 µm. Der Chip selbst kann als Gateelektrode genutzt werden, das Gateoxid zwischen Gate und den Interdigitalelektroden ist typisch SiO2 mit einer Dicke von 230 nm. © Fraunhofer IPMS / Chip AX1580, 15x15 mm², with 8 gold interdigital electrode pairs with a channel width of 10 mm and channel lengths of 2.5, 5, 10, and 20 µm. The chip itself can be used as a gate electrode; the gate oxide between the gate and the interdigital electrodes is typically SiO2 with a thickness of 230 nm. © Fraunhofer IPMS

The Fraunhofer Institute for Photonic Microsystems IPMS has developed innovative chips that are revolutionizing the characterization of organic materials and accelerating the development of new electronic applications. A newly developed measuring adapter allows for the first time simultaneous contact with up to eight interdigital electrode pairs, setting new standards in precise material analysis. In the context of the growing demand for flexible and efficient technologies, these high-precision measurement methods will be instrumental in improving the performance of future electronic systems.

Fraunhofer IPMS has made a significant breakthrough in materials research. The newly developed chips, which use interdigital electrodes, enable sensitive and innovative materials to be analyzed much more efficiently. These materials include those used in organic light-emitting diodes (OLEDs), organic solar cells, organic field-effect transistors (OFETs), and metal oxide-based gas sensors. This greatly simplifies the testing process, shortens development times, and represents a significant advancement in next-generation electronic technology development.

To tailor this performance to different applications, Fraunhofer IPMS has collaborated closely with partners and clients over the past few years. Project manager Henry Niemann explains, "We have continuously refined the chips, for example, by introducing new electrode geometries and materials and making adjustments to the gate oxide material and thickness." Until now, the simple and parallel contacting of multiple electrodes has been a particular challenge. However, with the new measurement adapter, Fraunhofer IPMS has succeeded in closing this gap. The adapter enables the parallel contact of multiple interdigital electrode pairs, significantly increasing the efficiency and quality of the testing process.

Group leader Alexander Graf adds: "Our customized chips allow materials researchers to accurately measure and optimize important parameters, such as conductivity, field effect, contact resistance, and charge carrier mobility." This lays the foundation for developing, optimizing, and reproducing materials and processes for customized solutions that meet industry's specific requirements.

A selection of interdigital electrode chips and the new measurement adapter will be presented at Analytica 2026 at the Fraunhofer booth A3 - #312. There, interested visitors will gain insights into specific application possibilities. Individual appointments can be arranged in advance via the website of the Fraunhofer Institute for Photonic Microsystems IPMS.


Fraunhofer-Institut für Photonische Mikrosysteme IPMS
01109 Dresden
Germany


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